Precision wafer substrates and end-to-end MEMS process services — one partner for fabs, foundries, and research institutions across 50+ countries.
Advanced Packaging Technologies
The Company
GINECHIP is a vertically integrated semiconductor substrate and process services provider — from raw material sourcing through cleanroom fabrication to certified shipment. Every wafer that leaves our facility carries a documented quality chain from a single accountable source.
For 10+ years, fabs, foundries, and research institutions in 50+ countries have relied on GINECHIP as a single-source partner for precision substrates and end-to-end process services — backed by ISO 9001 quality systems and ISO Class 5 cleanroom manufacturing.
Substrate Catalog
Browse our complete range of precision substrates across materials, sizes, and specifications.
Global Sourcing Network
We source premium substrates from the world's leading manufacturers — ensuring quality, reliability, and supply-chain resilience for your most demanding applications.
Shin-Etsu 
SUMCO 
GlobalWafers 
Siltronic 
SK Siltron 
Soitec 
Wafer Works 
Ferrotec 
NSIG 
Zhonghuan 
Tongmei 
Atecom 
Order Online
Skip the back-and-forth quoting cycle. Browse our live product catalog, add directly to cart, and check out securely — a full e-commerce experience built for engineers and procurement teams.
Filter the full SKU catalog by material, diameter, grade, and doping — with real-time stock status.
Add to cart and check out securely online — no purchase order required, no minimum order quantity.
Manage quotes, reorder past purchases, and track every shipment from your GINECHIP account dashboard.
Download technical datasheets and certificates of conformance directly from each product page.
Front-end lithography, thin-film deposition, DRIE, TSV, wafer bumping, and reclaim — performed in ISO Class 5 cleanrooms with full metrology documentation.
PVD, CVD, ALD processes for oxide, nitride, metal and dielectric films on 200mm and 300mm wafers.
Contact, proximity, and projection lithography down to 0.5µm resolution with full mask design support.
Solder bumps, Cu pillars, Au studs with full UBM stack. SnAg, SAC, AuSn metallurgies supported.
Chemical-mechanical stripping and re-polishing of used test wafers to virgin-grade surface quality.
Direct, anodic, eutectic, and adhesive bonding for SOI, MEMS, and advanced packaging applications.
Precision edge profiling and polishing to eliminate micro-cracks and ensure mechanical integrity during handling.
High-precision doping of silicon and compound semiconductor wafers with tailored ion species and energy profiles.
Permanent, high-contrast laser scribing of wafer IDs, lot numbers, and alignment marks for traceability.
Facility Capabilities
State-of-the-art tools enabling precision wafer fabrication, coating, patterning, and metrology — all under one roof.
Why GINECHIP
10+ years of semiconductor supply chain experience, engineering-grade quality standards, and cleanroom-to-cleanroom logistics — so your processes start right the first time.
Substrates and process services from one qualified team — no supply chain handoffs, no specification gaps between material and process.
Submit an RFQ with your process parameters and receive a complete technical quotation — with compatibility analysis — within one business day.
Any diameter, orientation, doping profile, film stack, or surface treatment — specified, verified, and documented to SEMI M1-M9 standards.
Every shipment leaves an ISO Class 5 facility with Certificate of Conformance, particle count data, and full metrology documentation.
Tailored wafer solutions across the semiconductor value chain.
Pressure sensors, accelerometers, gyroscopes, microphones. Substrates and process services for MEMS foundries.
Learn MoreGaAs, GaN-on-SiC, SOI substrates for RF front-end modules, power amplifiers, and mmWave devices.
Learn MoreSilicon photonics, VCSEL arrays, waveguide substrates, and LiDAR emitter/receiver wafers.
Learn MoreSiC and GaN epi-ready substrates for high-voltage power MOSFETs, Schottky diodes, and HEMTs.
Learn MoreRDL bump wafers, interposers, TSV substrates for 2.5D/3D heterogeneous integration and chiplets.
Learn MoreSmall-batch prototyping wafers, custom specifications, and flexible supply for university and corporate labs.
Learn MoreIn-depth technical insights, industry trends, and product application notes.
A fierce price war between monocrystalline and multicrystalline silicon wafer makers has driven prices down by up to 15% in just one month, reshaping the solar supply chain landscape.
Hua Hong Semiconductor, China’s second-largest wafer foundry, has priced its STAR Market IPO at RMB 52 per share, aiming to raise RMB 21.2 billion. The listing marks a major milestone as the company returns to A-shares, with strategic investors including the National Big Fund and key semiconductor supply chain players.
Co-packaged optics (CPO) puts silicon photonics engines beside switch ASICs to cut power and latency in AI data centers. See GINECHIP’s substrates for advanced packaging.
Submit your process parameters and our engineering team will respond with a complete technical quotation — including compatibility analysis — within one business day. No minimum order requirement.