Precision Wafer Substrates & Process
Services
Precision wafer substrates and end-to-end MEMS process services — one partner for fabs, foundries, and research institutions across 50+ countries.
Substrate Specifications at a Glance
From 100mm research-grade silicon to 300mm production wafers — every configuration engineered to your process.
Substrate Catalog
Featured Substrates
End-to-End MEMS & Semiconductor Processing
Front-end lithography, thin-film deposition, DRIE, TSV, wafer bumping, and reclaim — performed in ISO Class 5 cleanrooms with full metrology documentation.
Thin-Film Deposition
PVD, CVD, ALD processes for oxide, nitride, metal and dielectric films on 200mm and 300mm wafers.
Photolithography
Contact, proximity, and projection lithography down to 0.5µm resolution with full mask design support.
Wafer Bumping & UBM
Solder bumps, Cu pillars, Au studs with full UBM stack. SnAg, SAC, AuSn metallurgies supported.
Wafer Reclaim
Chemical-mechanical stripping and re-polishing of used test wafers to virgin-grade surface quality.
Why GINECHIP
Built for Process-Critical Applications
25+ years of semiconductor supply chain experience, engineering-grade quality standards, and cleanroom-to-cleanroom logistics — so your processes start right the first time.
Single-Source Partner
Substrates and process services from one qualified team — no supply chain handoffs, no specification gaps between material and process.
24-Hour Engineering Response
Submit an RFQ with your process parameters and receive a complete technical quotation — with compatibility analysis — within one business day.
Custom to Any SEMI Spec
Any diameter, orientation, doping profile, film stack, or surface treatment — specified, verified, and documented to SEMI M1-M9 standards.
Certified Cleanroom Supply
Every shipment leaves an ISO Class 5 facility with Certificate of Conformance, particle count data, and full metrology documentation.
Industries We Serve
Tailored wafer solutions across the semiconductor value chain.
MEMS & Sensors
Pressure sensors, accelerometers, gyroscopes, microphones. Substrates and process services for MEMS foundries.
Learn MoreRF & Power Devices
GaAs, GaN-on-SiC, SOI substrates for RF front-end modules, power amplifiers, and mmWave devices.
Learn MorePhotonics & LiDAR
Silicon photonics, VCSEL arrays, waveguide substrates, and LiDAR emitter/receiver wafers.
Learn MorePower Electronics
SiC and GaN epi-ready substrates for high-voltage power MOSFETs, Schottky diodes, and HEMTs.
Learn MoreAdvanced Packaging
RDL bump wafers, interposers, TSV substrates for 2.5D/3D heterogeneous integration and chiplets.
Learn MoreR&D & Academia
Small-batch prototyping wafers, custom specifications, and flexible supply for university and corporate labs.
Learn MoreLatest Technical Articles
In-depth technical insights, industry trends, and product application notes.
Specify Your Wafer. Get a Quotation in 24 Hours.
Submit your process parameters and our engineering team will respond with a complete technical quotation — including compatibility analysis — within one business day. No minimum order requirement.